A Method for In-Situ On-Wafer Four-Point Bending Test of Microbeams

Xufeng Wang, Jiakang Li, Yi Chen, Jiawei Zhou, Shiyang Yuan, Xuanqing Hua,Dacheng Zhang

2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)（2025）

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Key words

Four-point bending test,material tester,MEMS process quality

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