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论文共 218 篇作者统计合作学者相似作者

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Method for in Situ On-Wafer Tensile Test of Thin Films
Xufeng Wang, Jiakang Li, Yi Chen,Jiawei Zhou,Leijian Cheng,Dacheng Zhang
Micromachinesno. 3 (2025)
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A Method for In-Situ On-Wafer Four-Point Bending Test of Microbeams
Xufeng Wang, Jiakang Li, Yi Chen, Jiawei Zhou, Shiyang Yuan, Xuanqing Hua,Dacheng Zhang
2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)pp.647-650, (2025)
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Monolithic Integrated CMOS-MEMS Pressure Sensor with Piezoresistors Fabricated by Combinations of P-type Ion Implantation in the Standard CMOS Process
Fengyang Li, Zhiheng Yu, Changyuan Mai, Jiawei Zhou, Shiyang Yuan, Xuanqing Hua,Dacheng Zhang
2025 IEEE 38th International Conference on Micro Electro Mechanical Systems (MEMS)pp.623-626, (2025)
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Stiffness Imbalance Errors Trimming for Silicon Mems Tuning-Fork Gyroscopes with Low Cost Picosecond Lasers
Yuxian Liu,Qiancheng Zhao,Dacheng Zhang,Jian Cui
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)pp.1699-1702, (2023)
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Design and Analysis of High-Performance and Small-Size Piezoresistive Pressure Sensors
Chengwu Gao, Xuanqing Hua,Dacheng Zhang
IEEE SENSORS JOURNALno. 7 (2023): 6649-6659
引用4浏览0EIWOS引用
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Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition
Yuxian Liu,Qiancheng Zhao,Dacheng Zhang,Jian Cui
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGno. 2 (2023): 260-267
引用1浏览0EIWOS引用
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An On-Chip Bistable Structure for Extracting the Impact Fracture Strength of the Microstructure
Runze Yu,Dacheng Zhang
2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) (2022)
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作者统计

#Papers: 218

#Citation: 1635

H-Index: 23

G-Index: 36

Sociability: 6

Diversity: 3

Activity: 3

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