A SiCOHBEOL interconnect technology for high density and high performance 65 nm CMOS applications
M Angyal,J Gill,M Inohara,MF Ng, SH Rhee,S Lane,H Hichri,C Penny,I Melville,V Ramachandran,BC Zhang,YK Siew,F Zhang,KC Park,KW Lee,E Kaltalioglu,SO Kim,G Matusiewicz,YH Lin, K Urata,K Kumar, J Linville,M Minami, H Maynard,M Hoinkis,T Bolom, F Feustel,KS Lam,K Inoue,A Simon, J Smith, B Baker-O'Neal,L Economikos, P Ong, Y Ishikawa, M Naujok,A Sakamoto, T Ema, G Lembach, M Kelling, T Bailey, S Marrokey,WK Li,C Christiansen,BZ Li,T Lee,F Chen,K Chanda,R Filippi,PV McLaughlin,J Demarest,D Dunn,P Flaitz, B Rhoads, C Manya, A Calabrese,P Roper,K Petrarca,W Cote,D McHerron,A Cowley,T Ivers Advanced Metallization Conference 2005 (AMC 2005)（2006）
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