A Dual-Parameter On-Chip Test Platform Based on Thermal Actuator for Testing Fracture Strength of Microstructure
2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT)（2018）
Key words
thermal actuator,static tensile fracture strength,microbeam,etching,scanning electron microscopy,SEM,dynamic impact bending fracture strength,microstructure,fracture strength testing,dual-parameter on-chip test
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