An Experimental Study on a Barrier-less Cu Interconnect Scheme with Polyimide Insulator for Cost-Effective 3D Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology（2025）
Key words
Advanced packaging,Cu interconnect,polyimide (PI) insulator,three-dimensional (3D) integration,through-silicon-via (TSV)
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined