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Tailored Microstructure and Enhanced Bonding Strength of In-Situ Surface Modified Cu Flakes Via Oxidation–reduction Bonding

Siliang He, Xiangdong Liu, Zhiliang Pan, Sheng Gao,Yang Zuo,Hiroshi Nishikawa

Materials & Design（2025）

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关键词
Surface modification,Oxide growth,Reduction bonding,Nanoparticle
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