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Optimization Mechanism of Laminated Ceramic Package Structure on the Regulation of Semiconductor Cooling Performance

Shifeng Yan, Qian Zhao, Faxiang Wang, Yurun Bai, Tianxiang Liu,Wenzhong Guo,Changfu Zhang

Scientific reports(2025)

Cited 0|Views2
Key words
Semiconductor refrigeration,Mathematical modeling,Ceramic packaging materials condensation efficiency,Thermal conductivity optimization
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