Correction: Unprecedented Developed Composite Polishing System to Achieve Atomic Surface Integrating Rough and Fine Polishing Using a Novel Hyper-Conjugated Pad Through Controlling the Temperature of a Proposed Green Slurry

Efficiency and quality are a pair of everlasting contradictions in manufacturing industry. To achieve atomic surface, it usually consists of rough, precision, and ultra-precision polishing. These processes contain generally several to tens of polishing pads, slurries, and setups, which is time-consuming and expensive. These diverse pads, slurries, and setups are strictly separated, avoiding contamination, damage, and corrosion. To solve these challenges, a novel composite polishing system was developed, using a developed hyper-conjugated polishing pad and custom-made green slurry, through adjusting the temperature of slurry to control the material removal rate (MRR). The MRR was controlled between 40.99 and 133.91 nm/min, by adjusting the temperature between 40 and 80 ℃ via splitting of fibers. After pre-polishing by rare earth cerium oxide abrasive and atomic level polishing by proposed composite system, atomic surface is garnered on fused silica with surface roughness Sa of 0.117 nm at a scanning area of 50 × 50 μm2. It is unprecedented that the developed polishing system realized atomic surface integrating rough and fine polishing on a setup by a composite fiber polishing pad and a new green chemical mechanical polishing (CMP) slurry. The CMP slurry included silica, hydrogen peroxide, sodium hydroxy cellulose, and sodium carbonate. Transmission electron spectroscopy confirms that the thickness of damaged layer is 1.89 nm. Prior to and after splitting of fibers, diameter, bending length, and Shore hardness decreased from 18.33 to 2.48 μm, 13.7 to 4.6 cm, and 52.7 to 20.5 HC, respectively, reducing 86.5