Enhancing Mechanical Robustness and Integrity of a Large Advanced Package with Embedded Fine-Pitch Interconnect Chips
2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)（2024）
Key words
Mechanical Integrity,Mechanical Robustness,Cycling,Mechanical Performance,Finite Element Analysis,Design Software,Larger Package,Solder Joints,Design Considerations,Strain Energy,Mechanistic Aspects,Mechanical Design,Convex Shape,Strain Energy Density,Heterogeneous Integration,Flip-chip
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