Hyperspectral Component Fabrication on 200mm CMOS Image Sensor Wafer

Tina Babu Shylaja, Tae Jin Yoo,Bert Geelen,Klaas Tack,Deniz Sabuncuoglu Tezcan

2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)（2024）

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Key words

Hyperspectral,Sequential Steps,Near-infrared,Flat Areas,Wet Etching,Multiple Filters,Fabry-Perot Interferometer,Etching Step,Lithography Step,Cost-effective,Fabrication Process,Spectral Bands,Sidewall,Optical Filter,Etching Process,Dry Etching,Spectral Filtering,Metal Grid,Bragg Reflector,Bottom Of The Cavity,Optical Monitoring

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