14.4 A 51.6tflops/w Full-Datapath CIM Macro Approaching Sparsity Bound and <2-30 Loss for Compound AI
2025 IEEE International Solid-State Circuits Conference (ISSCC)（2025）
Key words
Sparsity,Exponent,Power Consumption,Load Data,Lossless,Edge Devices,Datapath,Flexible Patterns,Test Chip,Parallel Input,Sign Bit,Data Readout
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