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Tailoring the Microstructure, Physical, and Mechanical Properties of Pure Copper Using Various Additive Manufacturing Techniques

Yahya Aghayar,Parisa Moazzen,Leo A. I. Kestens,Mohsen Mohammadi

JOURNAL OF ALLOYS AND COMPOUNDS（2025）

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Key words
Laser powder bed fusion (LPBF),Hot isostatic pressing (HIP),Binder jetting,Pure copper (Cu),Electrical conductivity,Additive manufacturing
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