Enhanced Crack Resistance in Ceramic Shells Fabricated with Photosensitive Resin Models Printed by Stereolithography Through Buffer Layer Integration

Zhihui Li, Dawei Guan, Ya Tan, Xin Hao,Yunsong Zhao, Zhenqiang Wu, Weijie Xing, Sichen Li,Heng Gu,Yaozhong Zhang,Baode Sun,Fei Li

CERAMICS INTERNATIONAL（2025）

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Key words

SLA resin prototype,BLI,Cracking problem,Ceramic shell,Ansys simulation

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