Reduced Silver and Lead Consumption for Interconnection of the Rear Side of PERC+ Solar Cells by Ultrasonic Assisted Soldering
2024 IEEE 52nd Photovoltaic Specialist Conference (PVSC)（2024）
Key words
Solar Cells,Rear Side,Series Resistance,Contact Resistance,Resistance Measurements,Peel Test,Cell Surface,Impedance,I-V Curves,Passivation Layer,Fill Factor,Adhesion Mechanisms,Silicon Solar Cells,Ultrasonic Power,Photovoltaic Modules,Al Metal,Photoluminescence Imaging,Sonotrode
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