Development of High Modulus Temporary Bonding Material for 2.5D/3D IC Integration

Kang Li,Mingqi Huang, Jia Zhang, Yong Liu, Bo Liu, Jiayun Li, Jinchan Yang,Qiang Liu,Guoping Zhang

2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2024）

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关键词

back grinding,high modulus,temporary bonding and de-bonding

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