Controllable Deposition of Polyimide Insulation Layer by an Engineered Stepped Pre-curing Method in Double-sided TSV Processes
2024 7th International Conference on Electronics Technology (ICET)（2024）
关键词
through-silicon-via (TSV),polyimide (PI) liner,double-sided process,3D integration,electronic packaging
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要