A Chisel Generator for Standardized 3-D Die-to-Die Interconnects
IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS（2024）
Key words
Three-dimensional displays,Integrated circuit interconnections,Through-silicon vias,Device-to-device communication,Circuits,Timing,Redundancy,3-D integrated circuits,die-to-die (D2D) interconnects,generator,physical design (PD),physical layer (PHY),redundancy
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