Thermally Constrained Codesign of Heterogeneous 3-D Integration of Compute-in-Memory, Digital ML Accelerator, and RISC-V Cores for Mixed ML and Non-ML Workloads
IEEE Transactions on Very Large Scale Integration (VLSI) Systems（2024）
Key words
Augmented reality/virtual reality,compute-in-memory (CIM),heterogenous 3-D integration,machine learning (ML),RISC-V,thermally constrained framework
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