Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024（2024）
Key words
IoT,silicon interposer,optical I/O,optical energy harvesting,heterogeneous optical and electrical packaging,Heterogeneous Integration,Blockchain,GaN,III-V,LED
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