Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (tsvs) for Backside Power Delivery in 3D Interconnects
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024（2024）
Key words
Heterogeneous integration,Through Silicon Via,Thermomechanical reliability,Raman spectroscopy
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