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AlN: an Engineered Thermal Material for 3D Integrated Circuits

Sam Vaziri,Christopher Perez,Isha M. Datye,Heungdong Kwon,Chen-Feng Hsu,Michelle E. Chen,Maliha Noshin,Tung-Ying Lee,Mehdi Asheghi,Wei-Yen Woon,Eric Pop,Kenneth E. Goodson, Szuya S. Liao,Xinyu Bao

Advanced Functional Materials（2024）

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关键词
3D IC,aluminum nitride,phonon transport,thermal conductivity,thermal management
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