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Multiscale Microstructural Consideration for High Strength Diffusion Bonding of Ti2AlNb Alloy to GH4169 Superalloy with (tizrhfnb)95al5 Interlayer

MATERIALS & DESIGN(2024)

Cited 5|Views3
Key words
Ti2AlNb,GH4169,Holding time,Vacuum diffusion bonding,High entropy interlayer
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