Microstructure Evolution and Growth Kinetics of Cu6sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects under Ultrasonic Waves
Welding in the World（2025）
关键词
Ultrasonic-assisted soldering,Interfacial reaction,Intermetallic joints,Microstructure evolution,Growth kinetics
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