High Density Multi-Chip Embedded Panel-Level Packaging Integration Technology

Xianming Chen,Benxia Huang, Yejie Hong, Lei Feng, Jindong Feng, Guilin Zhu,Gao Huang, Yanlin Dong, Wu Chen

2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT（2023）

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Key words

Panel-Level,Multi-Chip Embedded,High Density,Packaging Integration Technology,High-Performance

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