Power Integrity Analysis for Interoperability of BoW Chiplet Interfaces

Ishan Mishra, Jayaprakash Balachandran, Wen-Sin Liew, Elad Alon,Srinivas Venkataraman,Shalabh Gupta

PROCEEDINGS OF THE 37TH INTERNATIONAL CONFERENCE ON VLSI DESIGN, VLSID 2024 AND 23RD INTERNATIONAL CONFERENCE ON EMBEDDED SYSTEMS, ES 2024（2024）

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关键词

Power integrity,BoW,OCP,SSN,supply noise,chiplet,package,PHY

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