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Organic Package Substrate Embedded Coupled Magnetic Core Inductors Using Lithographic Via Technology for Power Supply in Package

Weihao Zhang,Guoyun Zhou,Yan Hong,Xianming Chen,Benxia Huang, Xiaowei Xu,Shuai Ding,Zhaojun Zhu,Yongmao Huang,Wei He

Results in Physics（2024）

Cited 0|Views11
Key words
Coupled magnetic core inductor,Package-embedded integration,Interleaved converter,Lithographic via technology,Power supply in package
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