Parasitic Surface Conduction Effect of TSV on Interconnection Performance in RF SOI for 2.5D Integration
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）
关键词
Through Silicon Via,Thin Layer,S-parameters,Series Of Structures,Loss Of Connectivity,Silicon-on-insulator,Fabrication Process,Thermal Expansion,Printed Circuit Board,Back Side,Low-temperature Process,Copper Plate,Coplanar Waveguide,High Silicon
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