N3XT 3D Technology Foundations and Their Lab-to-Fab: Omni 3D Logic, Logic+Memory Ultra-Dense 3D, 3D Thermal Scaffolding

T. Srimani, A. Bechdolt, S. Choi,C. Gilardi, A. Kasperovich, S. Li,Q. Lin,M. Malakoutian, P. McEwen,R.M. Radway, D. Rich,A.C. Yu, S. Fuller, S. Achour,S. Chowdhury,H.-S. P. Wong,M. Shulaker,S. Mitra

2023 International Electron Devices Meeting (IEDM)（2023）

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Key words

Alternative Approach,Thermal Conductivity,Dielectric Constant,Peak Temperature,Heat Sink,Large Benefits,Task Scheduling,Physical Design,Power Delivery,3D Design,3D Stacks,Technology Node,Layer Integrity,3D Layer,Memory Technologies,Polycrystalline Diamond,Carbon Nanotubes

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