칩투칩 광결합을 이용한 DML 기반 4x80gbps 광송신 서브 모듈 제작

Kimseoktae,Han Young-Tak, Yun Jun, Donghun Lee,Shin Jang Uk, Park Sang Ho, Lee Seo Young,Baek Yongsoon

openalex（2020）

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