Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling

Pearl A. Agyakwa,Stuart Robertson,Jingru Dai,Bassem Mouawad,Zhaoxia Zhou,Changqing Liu,C. Mark Johnson

Journal of Electronic Materials（2024）

Cited 4|Views11

Key words

Sintered nano-silver,SiC die-attach,3D x-ray tomography,3D FIB/EBSD,correlative microscopy,die attachment,thermomechanical fatigue,reliability,power electronics,power cycling test

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