Demonstration of a Wafer Level Face-To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）
Key words
3D Integration,Hybrid Bonding,Wafer Level,3Layers,High Density TSV,Fine Pitch
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