Artificial Intelligence (AI) Based Methodology to Minimize Asymmetric Bare Substrate Warpage
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）
关键词
heterogeneous integration,fine-pitch organic substrates,substrate warpage reduction,copper volume percent optimization,machine learning
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要