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Advanced 3D Integration TSV and Flip Chip Technologies Evaluation for the Packaging of a Mobile LiDAR 256 Channels Beam Steering Device Designed for Autonomous Driving Application

Thierry Mourier,Nadia Miloud-Ali Berchet,Juliette Auffret,Natacha Raphoz,Yacoub Sahouane,Damien Saint Patrice,Edouard Deschaseaux,Patrick Peray,Sylvain Guerber,Francois Simoens

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

Cited 1|Views13
Key words
LiDAR,Optical Phase Array,TSV,Flip chip,Thermocompression,Mass reflow,Autonomous driving,Packaging,Photonic
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