A Novel Stacked-via Cu/ELK Interconnection Design Configuration to Enhance Advanced Si Packages Reliability Performance
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）
关键词
High-performance flip chip ball grid array (HFCBGA) package,Cu bump,extra low-k (ELK) dielectric,stacked-via Cu/ELK interconnection,three-level stacked-via finite element global-local technique method,chip-package-interaction (CPI),thermal cycling loading,thermal stress
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要