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Enhancement of Cooling Performance in MEMS by Modifying 3D Packaging Structure: A Design, Integration, Analysis and Test Study

Rong Li,Zhanbin Wu,Ziyue Wang,Lihua He,Ming Xiong, Tingting Liu, Min Kong,Ban Wang,Juyong Zhang

Applied Thermal Engineering（2024）

引用 1|浏览25
关键词
MEMS,3D integration,Packaging,Cooling structure,Cooling performance
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