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Space-Borne System-in-Package Based on High Reliability Microwave Interconnections

Bin Li,Guobin Wan, Yun Li, Zhaoshen Shao,Guowei Chen,Fengchao Ren, Jiaqi Su

Electronics（2023）

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关键词
high reliability,space-borne,microwave interconnection,system-in-package
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