An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding.Seyed Amir Fouad Farshchi Yazdi,Matteo Garavaglia,Aldo Ghisi,Alberto CoriglianoMICROMACHINES（2023）引用 1|浏览4关键词glass frit bonding,wafer warpage,FE analysis,residual stressesAI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
