深低温大功率电阻阵列封装结构研究
Infrared and Laser Engineering（2022）
Abstract
电阻阵列的封装需求向着集成度高、大功率、深低温方向发展.为了满足130 K以下低温工作、稳态功率100 W以上的深低温应用需求,提出了一种利用液氮进行制冷的集成封装结构,并利用有限元仿真和实测验证相结合的方法验证了装置的制冷能力.结果表明,热沉钼与陶瓷电极板的厚度均为2 mm的情况下,加热功率在0.1-192.76 W区间内,有限元仿真得到的温度与实测温度最大误差小于7.67％,引起误差的主要原因是封装结构件的体热阻及界面热阻随温度发生变化而仿真时采用恒定热阻.结构能够在加热功率小于211.90W的工况下正常工作.在设计的100 W稳定加热工况下,芯片衬底温度不高于101.9 K,热应力为5.66 MPa,满足设计要求.
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