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Study of Surface Interactions for Encapsulation of Phase Change Memory Materials

L. Buzi, D. Koty,M. Hopstaken,J. Bruley,L. Gignac, M. Sagianis,D. Farmer,H. Miyazoe,A. Mosden,S. Engelmann,R. L. Bruce

ADVANCED ETCH TECHNOLOGY AND PROCESS INTEGRATION FOR NANOPATTERNING XI（2022）

Cited 1|Views45
Key words
Plasma Enhanced Chemical Vapor Deposition,Silicon nitride,In-situ Encapsulation,Phase Change Memory,Reactive Ion Etching,GeSbTe,Plasma damage
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