SCIP to the Next Generation of Computing: Extending More Than Moore with Silicon Photonics Chiplets in Package (SCIP)
2022 23rd International Symposium on Quality Electronic Design (ISQED)（2022）
Key words
Silicon Photonics,Artificial Intelligence (AI) Chips,Machine Learning (ML),Graphic Processor Unit (GPU) Chips,Chiplets technology,Memory Disaggregation,Multi-Chip Packaging,Advanced Packaging,scale up and scale out networking architectures
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