300 MM Wafer Laser Anneal Process Development for Applications of Multiple Process Condition in Different Zones on Single Wafer

Xiaoxu Kang, Yuanhao Huang, Wen Luo, Jianrui Liu,Zhenghui Chu,Xiaolan Zhong,Min Zhang,Xiaoqiang Zhou,Kaiyan Zang,Ming Li,Limin Zhu,Hanwei Lu,Bo Zhang

2022 China Semiconductor Technology International Conference (CSTIC)（2022）

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300 MM wafer laser anneal process development,multiple process condition,single wafer,technology developing,lower thermal budget,shallow junction application,implantation process,different laser annealing condition,different laser annealing parameters,implanted wafer

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