Effect of Cu on the Interfacial Reaction Between Sn-based Solders and FeCoNiCu Alloys

Yu -An Shen, Xiu-Mei Yang, Cheng -Yu Tsai, Yu-Hung Ouyang,Ming-Hung Tsai,Tao -Tsung Shun

Intermetallics（2022）

引用 15|浏览3

关键词

Multielement alloy,Lead-free solder,Wettability,Multielement intermetallic compound,Thermal stability,Interfacial reaction

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