Thermal Mitigation and Optimization Via Multitier Bond Wire Layout for IGBT Modules Considering Multicellular Electro-Thermal Effect
IEEE Transactions on Power Electronics（2022）
关键词
Wires,Bonding,Insulated gate bipolar transistors,Metallization,Layout,Stress,Resistance,Electro-thermal coupling,Fourier series,multitier layout,physics-based IGBT model,stitch-bonding wire,three-dimensional (3-D) multicellular equivalent circuit,wire layout optimization
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