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Middle of Line: Challenges and Their Resolution for FinFET Technology

Shiv Kumar Mishra, Erik Geiss,Aditya Kumar,Arkadiusz Malinowski,Gao Wen Zhi,Wenhe Lin, Bangun Indajang, Dustin Slisher

2020 31ST ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC)(2020)

引用 4|浏览2
关键词
CMOS,FinFET,Middle of Line (MOL),Replacement metal Gate (RMG),Scaling,Overlay,Moore’s Law
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