45RFSOI WLCSP Board Level Package Risk Assessment and Solder Joint Reliability Performance Improvement
Electronic Components and Technology Conference（2020）
关键词
WLCSP,board level reliability,temperature cycling test,Weibull analysis,finite element method,numerical simulation,fatigue model,package reliability
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要