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Investigating Process Variability at Ppm Level Using Advanced Massive Ebeam CD Metrology and Contour Analysis

B. Le-Gratiet, O. Mermet,C. Gardin, S. Desmoulins,T. Kiers,Y. Wang, P. Tang, D. Tien,F. Wang,C. Prentice, W. Tel,S. Hunsche

Metrology, Inspection, and Process Control for Microlithography XXXIII（2019）

Cited 11|Views13
Key words
pattern variability,pattern fidelity,contour analysis,edge placement error,holistic lithography,SEM metrology
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