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EUV Via Hole Pattern Fidelity Enhancement Through Novel Resist and Post-Litho Plasma Treatment

Hidetami Yaegashi,Kyohei Koike,Carlos Fonseca,Fumiko Yamashita,Kumar Kaushik,Shinya Morikita,Kiyohito Ito,Shota Yoshimura,Vadim Timoshkov,Mark Maslow, Tae Kwon Jee,Liesbeth Reijnen,Peter Choi, Mu Feng,Chris Spence,Stijn Schoofs

ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXV（2018）

Cited 2|Views17
Key words
7nm node,hole-shrink,CD healing,CER,local CDU
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