Test Structures for Developing Packaging for Implantable Sensors

E. O. Blair, A. Buchoux,A. Tsiamis,C. Dunare,J. R. K. Marland,M. E. Gray,J. G. Terry,S. Smith,A. J. Walton

IEEE Transactions on Semiconductor Manufacturing（2020）

引用 3|浏览2

关键词

Packaging,Sensors,Semiconductor device measurement,Electrodes,Current measurement,Wires,Adhesives,Implantable,microsystems,packaging,reliability,sensors,test structures

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