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A Reliability Overview of Intel’s 10+ Logic Technology

R. Grover, T. Acosta, C. AnDyke, E. Armagan,C. Auth,S. Chugh, K. Downes,M. Hattendorf,N. Jack,S. Joshi,R. Kasim,G. Leatherman, S-H Lee,C-Y Lin,A. Madhavan, H. Mao, A. Lowrie,G. Martin, G. McPherson,P. Nayak,A. Neale, D. Nminibapiel, B. Orr,J. Palmer,C. Pelto,S. S. Poon,I Post,T. Pramanik,A. Rahman,S. Ramey,N. Seifert,K. Sethi,A. Schmitz, H. Wu,A. Yeoh

IEEE International Reliability Physics Symposium（2020）

Cited 6|Views64
Key words
cobalt interconnects,finFET,MIM capacitor,Pb-free packaging,thick metal
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