Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints During Isothermal Aging
Materials（2020）
Key words
Sn2.5Ag0.7Cu0.1RE/Cu soldering,dynamic observation,isothermal aging,intermetallic compound,growth kinetics,fracture mechanism
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